Wafer and cell production

Automation systems for wafer and cell fabrication

Wafer pick and place system

  • Automated pick- up of wafers from the cassettes
  • Automated placement of wafers into the carrier
  • Automated wafer pick-up  from carrier and placing into cassettes
  • Buffer  for cassettes in the loading and pick-up machine
  • Inspection of testing criteria: identification of the cell position, inspection of wafer edge chipping

Optional:

  • Turning the wafers for SSU (sunny side up) or SSD (sunny side down) procedure
  • Inspection of colour intensity

TECHNICAL DATA:

Cycle time 1. sec. / wfer
Breaking rate < 0.% (pe station)
Wafer types mono-, polycristalline
Wafer dimensions: 125 x 125 mm; 156 x 156 mm, miscellaneous
Wafer thickness: > 150 µm

 

Pick and place station 30 MW

  • Robot Handlings
  • Automated handling systems, including all systems necessary to safeguard product quality
  • Automated wafer turning by flippers
  • Automated wafer feeding by conveyor belts and/or  shutters
  • Buffer for stack boxes or cassettes inside the stations
  • Inspection functions: identification of cell position, recognition of wafer edge chipping

TECHNICAL DATA:

Cycle time: 2.3 sec. / wafer
Breakage rate: < 0.1% (per station)
Wafer types: mono-, polycristalline
Wafer dimensions: 125 x 125 mm; 156 x 156 mm, miscellaneous
Wafer thickness: > 150 µm

Pick and place station 60 MW

  • Robot handlings
  • Automated handling systems, including all systems required to ensure product quality
  • Automated wafer turning by flippers
  • Automated wafer feeding by conveyor belts and/ or shutters
  • Buffer for stack boxes or cassettes inside the stations
  • Inspection functions: identification of cell position, recognition of wafer edge chipping

TECHNICAL DATA:

Cycle time: 1.5 sec. / wafer
Breakage rate: < 0.1% (per station)
Wafer types: mono-, polycristalline
Wafer dimensions: 125 x 125 mm; 156 x 156 mm,  miscellaneous
Wafer thickness: > 150 µm

Wafer testers

  • Automated placement of wafer - picked up from stack boxes - into equipment
  • Inspection of the following testing criteria:
    - Recognition of wafer position
    - Edge chipping inspection
    - Geometry and angularity testing
    - Thickness testing / TTV (total thickness variation)
    - Life and resistivity testing
    - Microfracture and hole testing
    - Wafer doping test
    - Detection of wafer dicing defects
  • Automated placement of wafers in stack boxes
  • Sorting range with 12 classes, to be extended flexibly

TECHNICAL DATA:

Cycle time: 2400 wafers/h
Breakage rate: < 0.1% 
Wafer types: mono-, polycristalline
Wafer dimensions: 125 x 125 mm; 156 x 156 mm,  210 x 210 mm, miscellaneous
Wafer thickness: 160 - -350 µm

Lase edge isolation

  • Automated handling/ feeding systems for inline adaption
  • Working method in double placement
  • Automated wafer transport
  • Buffer for stack boxes or cassettes inside the station

TECHNICAL DATA:

Cycle time: 2400 wafers/h
Breakage rate: < 0.2% 
Wafer tyoes: mono-, polycristalline
Wafer dimensions: 125 x 125 mm; 156 x 156 mm,  miscellaneous
Wafer thickness: 160 - -200 µm

Cell testers

  • Automated loading of cells from stack boxes
  • Inspection of the following criteria:
    - Geometry
    - Front side
    - Back side
    - Colour homogeneity
    - Cratering phenomena
    - Electric power measurement by means of flashers
    - Microcracks by means of electroluminescence testing
  • Automated placement of cells in stack boxes
  • Sorting range

TECHNICAL DATA

Cycle time: 1.400 wafers/h
Breakage rate: < 0.2%
Wafer types: mono-, polycristalline
Wafer dimensions: 125 x 125 mm; 156 x 156 mm, miscellaneous
Wafer thickness: 160-200 µm